high temperature heat thermal conduction epoxy anti wear adhesives

BD104 high temperature epoxy heat conduction thermal
conductive adhesive


Product description of BD104 heat conductive high temperature resistant epoxy adhesives:
It’s the thermal heat conductivity structural adhesive which taken advantage of the atomic and molecular structures
feature in terms of heat conduction and the bonding performance of high molecular material to do the effective optimization,
recombination and configuration.

Range of application of BD104 high temperature resistant epoxy thermal conduction adhesive:
Widely used in bonding among needing thermal heat conduction parts in the military industry,high-tech products.Such as applied to hot electron device,pyroelectric sensor,new type power supply,electronic equipment,
thermal measurement,refrigeration equipment etc.

Operation time:
After making the A and B double components mix uniformly according to the mass ratio A:B=4:1,the operation time is
40 min at room temperature.

Curing condition:
It can be put into use based on curing for 24 hours at the temperature of 25 degree.It can be fully curing,
if you heat it up to the temperature of 100 degree and keep this temperature for 2 hours.

1.When the environment temperature is higher or mixing quantity is larger,the operation time will be shorten.

2.Sealing for storage in a cool and dry environment,transport it as a non-dangerous product.

3.This product is a non-dangerous product,but don’t make it touch with mouth and eyes,the allergic constitution should
use it more carefully.

Product packaging photo of BD104 high temperature resistant thermal heat conductive adhesives:


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